As a part of ESI’s market-leading family of flex PCB processing systems, CapStone™ leverages ESI’s new laser technology, fluence control and beam positioning. This combination delivers the fastest blind via processing times in the industry and enables FPC processors to process a wider range of materials at high yields and high productivity with minimum process development and maximum uptime. CapStone significantly reduces cost of ownership for the full spectrum of applications and pattern densities considered by leading flex circuit manufacturers.
PCB Laser Processing, HDI PCB manufacturing, flex PCB processing, flex PCBmore
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